Atomic dynamics model for nanoscale ductile mode cutting of silicon wafers

Atomic dynamics model for nanoscale ductile mode cutting of silicon wafers

Master's

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Bibliographic Details
Main Author: HE TAO
Other Authors: MECHANICAL ENGINEERING
Format: Theses and Dissertations
Language:English
Published: 2010
Subjects:
wafer fabrication; ductile mode cutting; chip formation mechanism; critical chip thickness; atomistic model; tool wear;
Online Access:http://scholarbank.nus.edu.sg/handle/10635/17005
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Institution: National University of Singapore
Language: English

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