Self-assembled three dimensional network designs for soft electronics

• Main Authors: Jang, K.-I, Li, K, Chung, H.U, Xu, S, Jung, H.N, Yang, Y, Kwak, J.W, Jung, H.H, Song, J, Yang, C, Wang, A, Liu, Z, Lee, J.Y, Kim, B.H, Kim, J.-H, Lee, J, Yu, Y, Kim, B.J, Jang, H, Yu, K.J, Kim, J, Lee, J.W, Jeong, J.-W, Song, Y.M, Huang, Y, Zhang, Y, Rogers, J.A
• Other Authors: DEPT OF ELECTRICAL & COMPUTER ENGG
• Format: Article
• Published: Nature Publishing Group 2020
• Subjects: encapsulation; experimental design; mechanics; network analysis; optimization; performance assessment; sensor; Article; biocompatibility; biomedical engineering; controlled study; electric activity; electrocardiography; electronic sensor; finite element analysis; geometry; medical electronics; microtechnology; process optimization; skin; three dimensional imaging; virtual reality; Young modulus
• Online Access: https://scholarbank.nus.edu.sg/handle/10635/179710
• Institution: National University of Singapore

10.1038/ncomms15894