Self-assembled three dimensional network designs for soft electronics
10.1038/ncomms15894
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sg-nus-scholar.10635-1797102023-09-20T08:43:06Z Self-assembled three dimensional network designs for soft electronics Jang, K.-I Li, K Chung, H.U Xu, S Jung, H.N Yang, Y Kwak, J.W Jung, H.H Song, J Yang, C Wang, A Liu, Z Lee, J.Y Kim, B.H Kim, J.-H Lee, J Yu, Y Kim, B.J Jang, H Yu, K.J Kim, J Lee, J.W Jeong, J.-W Song, Y.M Huang, Y Zhang, Y Rogers, J.A DEPT OF ELECTRICAL & COMPUTER ENGG encapsulation experimental design mechanics network analysis optimization performance assessment sensor Article biocompatibility biomedical engineering controlled study electric activity electrocardiography electronic sensor encapsulation finite element analysis geometry mechanics medical electronics microtechnology process optimization skin three dimensional imaging virtual reality Young modulus 10.1038/ncomms15894 Nature Communications 8 15894 2020-10-26T02:45:18Z 2020-10-26T02:45:18Z 2017 Article Jang, K.-I, Li, K, Chung, H.U, Xu, S, Jung, H.N, Yang, Y, Kwak, J.W, Jung, H.H, Song, J, Yang, C, Wang, A, Liu, Z, Lee, J.Y, Kim, B.H, Kim, J.-H, Lee, J, Yu, Y, Kim, B.J, Jang, H, Yu, K.J, Kim, J, Lee, J.W, Jeong, J.-W, Song, Y.M, Huang, Y, Zhang, Y, Rogers, J.A (2017). Self-assembled three dimensional network designs for soft electronics. Nature Communications 8 : 15894. ScholarBank@NUS Repository. https://doi.org/10.1038/ncomms15894 2041-1723 https://scholarbank.nus.edu.sg/handle/10635/179710 Attribution 4.0 International http://creativecommons.org/licenses/by/4.0/ Nature Publishing Group Unpaywall 20201031 |
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encapsulation experimental design mechanics network analysis optimization performance assessment sensor Article biocompatibility biomedical engineering controlled study electric activity electrocardiography electronic sensor encapsulation finite element analysis geometry mechanics medical electronics microtechnology process optimization skin three dimensional imaging virtual reality Young modulus |
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encapsulation experimental design mechanics network analysis optimization performance assessment sensor Article biocompatibility biomedical engineering controlled study electric activity electrocardiography electronic sensor encapsulation finite element analysis geometry mechanics medical electronics microtechnology process optimization skin three dimensional imaging virtual reality Young modulus Jang, K.-I Li, K Chung, H.U Xu, S Jung, H.N Yang, Y Kwak, J.W Jung, H.H Song, J Yang, C Wang, A Liu, Z Lee, J.Y Kim, B.H Kim, J.-H Lee, J Yu, Y Kim, B.J Jang, H Yu, K.J Kim, J Lee, J.W Jeong, J.-W Song, Y.M Huang, Y Zhang, Y Rogers, J.A Self-assembled three dimensional network designs for soft electronics |
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10.1038/ncomms15894 |
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DEPT OF ELECTRICAL & COMPUTER ENGG |
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DEPT OF ELECTRICAL & COMPUTER ENGG Jang, K.-I Li, K Chung, H.U Xu, S Jung, H.N Yang, Y Kwak, J.W Jung, H.H Song, J Yang, C Wang, A Liu, Z Lee, J.Y Kim, B.H Kim, J.-H Lee, J Yu, Y Kim, B.J Jang, H Yu, K.J Kim, J Lee, J.W Jeong, J.-W Song, Y.M Huang, Y Zhang, Y Rogers, J.A |
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Article |
author |
Jang, K.-I Li, K Chung, H.U Xu, S Jung, H.N Yang, Y Kwak, J.W Jung, H.H Song, J Yang, C Wang, A Liu, Z Lee, J.Y Kim, B.H Kim, J.-H Lee, J Yu, Y Kim, B.J Jang, H Yu, K.J Kim, J Lee, J.W Jeong, J.-W Song, Y.M Huang, Y Zhang, Y Rogers, J.A |
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Jang, K.-I |
title |
Self-assembled three dimensional network designs for soft electronics |
title_short |
Self-assembled three dimensional network designs for soft electronics |
title_full |
Self-assembled three dimensional network designs for soft electronics |
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Self-assembled three dimensional network designs for soft electronics |
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Self-assembled three dimensional network designs for soft electronics |
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self-assembled three dimensional network designs for soft electronics |
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Nature Publishing Group |
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2020 |
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https://scholarbank.nus.edu.sg/handle/10635/179710 |
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