Self-assembled three dimensional network designs for soft electronics

10.1038/ncomms15894

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Main Authors:	Jang, K.-I, Li, K, Chung, H.U, Xu, S, Jung, H.N, Yang, Y, Kwak, J.W, Jung, H.H, Song, J, Yang, C, Wang, A, Liu, Z, Lee, J.Y, Kim, B.H, Kim, J.-H, Lee, J, Yu, Y, Kim, B.J, Jang, H, Yu, K.J, Kim, J, Lee, J.W, Jeong, J.-W, Song, Y.M, Huang, Y, Zhang, Y, Rogers, J.A
其他作者:	ELECTRICAL AND COMPUTER ENGINEERING
格式:	Article
出版:	Nature Publishing Group 2020
主題:	encapsulation experimental design mechanics network analysis optimization performance assessment sensor Article biocompatibility biomedical engineering controlled study electric activity electrocardiography electronic sensor finite element analysis geometry medical electronics microtechnology process optimization skin three dimensional imaging virtual reality Young modulus
在線閱讀:	https://scholarbank.nus.edu.sg/handle/10635/179710
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id	sg-nus-scholar.10635-179710
record_format	dspace
spelling	sg-nus-scholar.10635-1797102024-11-15T18:12:25Z Self-assembled three dimensional network designs for soft electronics Jang, K.-I Li, K Chung, H.U Xu, S Jung, H.N Yang, Y Kwak, J.W Jung, H.H Song, J Yang, C Wang, A Liu, Z Lee, J.Y Kim, B.H Kim, J.-H Lee, J Yu, Y Kim, B.J Jang, H Yu, K.J Kim, J Lee, J.W Jeong, J.-W Song, Y.M Huang, Y Zhang, Y Rogers, J.A ELECTRICAL AND COMPUTER ENGINEERING encapsulation experimental design mechanics network analysis optimization performance assessment sensor Article biocompatibility biomedical engineering controlled study electric activity electrocardiography electronic sensor encapsulation finite element analysis geometry mechanics medical electronics microtechnology process optimization skin three dimensional imaging virtual reality Young modulus 10.1038/ncomms15894 Nature Communications 8 15894 2020-10-26T02:45:18Z 2020-10-26T02:45:18Z 2017 Article Jang, K.-I, Li, K, Chung, H.U, Xu, S, Jung, H.N, Yang, Y, Kwak, J.W, Jung, H.H, Song, J, Yang, C, Wang, A, Liu, Z, Lee, J.Y, Kim, B.H, Kim, J.-H, Lee, J, Yu, Y, Kim, B.J, Jang, H, Yu, K.J, Kim, J, Lee, J.W, Jeong, J.-W, Song, Y.M, Huang, Y, Zhang, Y, Rogers, J.A (2017). Self-assembled three dimensional network designs for soft electronics. Nature Communications 8 : 15894. ScholarBank@NUS Repository. https://doi.org/10.1038/ncomms15894 2041-1723 https://scholarbank.nus.edu.sg/handle/10635/179710 Attribution 4.0 International http://creativecommons.org/licenses/by/4.0/ Nature Publishing Group Unpaywall 20201031
institution	National University of Singapore
building	NUS Library
continent	Asia
country	Singapore Singapore
content_provider	NUS Library
collection	ScholarBank@NUS
topic	encapsulation experimental design mechanics network analysis optimization performance assessment sensor Article biocompatibility biomedical engineering controlled study electric activity electrocardiography electronic sensor encapsulation finite element analysis geometry mechanics medical electronics microtechnology process optimization skin three dimensional imaging virtual reality Young modulus
spellingShingle	encapsulation experimental design mechanics network analysis optimization performance assessment sensor Article biocompatibility biomedical engineering controlled study electric activity electrocardiography electronic sensor encapsulation finite element analysis geometry mechanics medical electronics microtechnology process optimization skin three dimensional imaging virtual reality Young modulus Jang, K.-I Li, K Chung, H.U Xu, S Jung, H.N Yang, Y Kwak, J.W Jung, H.H Song, J Yang, C Wang, A Liu, Z Lee, J.Y Kim, B.H Kim, J.-H Lee, J Yu, Y Kim, B.J Jang, H Yu, K.J Kim, J Lee, J.W Jeong, J.-W Song, Y.M Huang, Y Zhang, Y Rogers, J.A Self-assembled three dimensional network designs for soft electronics
description	10.1038/ncomms15894
author2	ELECTRICAL AND COMPUTER ENGINEERING
author_facet	ELECTRICAL AND COMPUTER ENGINEERING Jang, K.-I Li, K Chung, H.U Xu, S Jung, H.N Yang, Y Kwak, J.W Jung, H.H Song, J Yang, C Wang, A Liu, Z Lee, J.Y Kim, B.H Kim, J.-H Lee, J Yu, Y Kim, B.J Jang, H Yu, K.J Kim, J Lee, J.W Jeong, J.-W Song, Y.M Huang, Y Zhang, Y Rogers, J.A
format	Article
author	Jang, K.-I Li, K Chung, H.U Xu, S Jung, H.N Yang, Y Kwak, J.W Jung, H.H Song, J Yang, C Wang, A Liu, Z Lee, J.Y Kim, B.H Kim, J.-H Lee, J Yu, Y Kim, B.J Jang, H Yu, K.J Kim, J Lee, J.W Jeong, J.-W Song, Y.M Huang, Y Zhang, Y Rogers, J.A
author_sort	Jang, K.-I
title	Self-assembled three dimensional network designs for soft electronics
title_short	Self-assembled three dimensional network designs for soft electronics
title_full	Self-assembled three dimensional network designs for soft electronics
title_fullStr	Self-assembled three dimensional network designs for soft electronics
title_full_unstemmed	Self-assembled three dimensional network designs for soft electronics
title_sort	self-assembled three dimensional network designs for soft electronics
publisher	Nature Publishing Group
publishDate	2020
url	https://scholarbank.nus.edu.sg/handle/10635/179710
_version_	1821183055264481280

Self-assembled three dimensional network designs for soft electronics

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