Self-assembled three dimensional network designs for soft electronics
10.1038/ncomms15894
Saved in:
Main Authors: | Jang, K.-I, Li, K, Chung, H.U, Xu, S, Jung, H.N, Yang, Y, Kwak, J.W, Jung, H.H, Song, J, Yang, C, Wang, A, Liu, Z, Lee, J.Y, Kim, B.H, Kim, J.-H, Lee, J, Yu, Y, Kim, B.J, Jang, H, Yu, K.J, Kim, J, Lee, J.W, Jeong, J.-W, Song, Y.M, Huang, Y, Zhang, Y, Rogers, J.A |
---|---|
其他作者: | ELECTRICAL AND COMPUTER ENGINEERING |
格式: | Article |
出版: |
Nature Publishing Group
2020
|
主題: | |
在線閱讀: | https://scholarbank.nus.edu.sg/handle/10635/179710 |
標簽: |
添加標簽
沒有標簽, 成為第一個標記此記錄!
|
機構: | National University of Singapore |
相似書籍
-
The growth of carbon nanostructure on the mechanical-milling-derived catalyst precursors
由: Liu, B.H., et al.
出版: (2014) -
Encapsulation of protein drugs in biodegradable microparticles by co-axial electrospray
由: Xie, J., et al.
出版: (2014) -
Encapsulation of lutein via microfluidic technology: Evaluation of stability and in vitro bioaccessibility
由: Yao, Yuanhang, et al.
出版: (2022) -
Investigation of droplet distribution in electrohydrodynamic atomization (EHDA) using an ac-based electrical capacitance tomography (ECT) system with an internal-external electrode sensor
由: Rezvanpour, A., et al.
出版: (2014) -
Inwards buildup of concentric polymer layers: A method for biomolecule encapsulation and microcapsule encoding
由: Bai, J., et al.
出版: (2014)