Plasmonic interconnects for global wires in integrated circuits

Plasmonic interconnects for global wires in integrated circuits

International Journal of Nanotechnology

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Bibliographic Details
Main Authors: Soo-jin Chua, Yan Liu, Lu Ding, Aaron Thean, Ting Mei, Christian A. Nijhuis
Other Authors: Cong, Nghe
Format: Article
Language:English
Published: InderScience 2020
Subjects:
intra-chip communication
near-field signal
plasmonic interconnect
insulator-metalinsulator plasmonic waveguide
Online Access:https://scholarbank.nus.edu.sg/handle/10635/183431
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Institution: National University of Singapore
Language: English

Internet

https://scholarbank.nus.edu.sg/handle/10635/183431

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