Plasmonic interconnects for global wires in integrated circuits

International Journal of Nanotechnology

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Bibliographic Details
Main Authors:	Soo-jin Chua, Yan Liu, Lu Ding, Aaron Thean, Ting Mei, Christian A. Nijhuis
Other Authors:	Cong, Nghe
Format:	Article
Language:	English
Published:	InderScience 2020
Subjects:	intra-chip communication near-field signal plasmonic interconnect insulator-metalinsulator plasmonic waveguide
Online Access:	https://scholarbank.nus.edu.sg/handle/10635/183431
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Institution:	National University of Singapore
Language:	English

id	sg-nus-scholar.10635-183431
record_format	dspace
spelling	sg-nus-scholar.10635-1834312024-11-15T18:48:04Z Plasmonic interconnects for global wires in integrated circuits Soo-jin Chua Yan Liu Lu Ding Aaron Thean Ting Mei Christian A. Nijhuis Cong, Nghe ELECTRICAL AND COMPUTER ENGINEERING CHEMISTRY NUS NANOSCIENCE & NANOTECH INITIATIVE intra-chip communication near-field signal plasmonic interconnect insulator-metalinsulator plasmonic waveguide International Journal of Nanotechnology 17 7 541-549 2020-11-13T07:32:57Z 2020-11-13T07:32:57Z 2019-11-09 Article Soo-jin Chua, Yan Liu, Lu Ding, Aaron Thean, Ting Mei, Christian A. Nijhuis (2019-11-09). Plasmonic interconnects for global wires in integrated circuits. International Journal of Nanotechnology 17 (7) : 541-549. ScholarBank@NUS Repository. https://scholarbank.nus.edu.sg/handle/10635/183431 en Attribution-ShareAlike 4.0 International http://creativecommons.org/licenses/by-sa/4.0/ InderScience
institution	National University of Singapore
building	NUS Library
continent	Asia
country	Singapore Singapore
content_provider	NUS Library
collection	ScholarBank@NUS
language	English
topic	intra-chip communication near-field signal plasmonic interconnect insulator-metalinsulator plasmonic waveguide
spellingShingle	intra-chip communication near-field signal plasmonic interconnect insulator-metalinsulator plasmonic waveguide Soo-jin Chua Yan Liu Lu Ding Aaron Thean Ting Mei Christian A. Nijhuis Plasmonic interconnects for global wires in integrated circuits
description	International Journal of Nanotechnology
author2	Cong, Nghe
author_facet	Cong, Nghe Soo-jin Chua Yan Liu Lu Ding Aaron Thean Ting Mei Christian A. Nijhuis
format	Article
author	Soo-jin Chua Yan Liu Lu Ding Aaron Thean Ting Mei Christian A. Nijhuis
author_sort	Soo-jin Chua
title	Plasmonic interconnects for global wires in integrated circuits
title_short	Plasmonic interconnects for global wires in integrated circuits
title_full	Plasmonic interconnects for global wires in integrated circuits
title_fullStr	Plasmonic interconnects for global wires in integrated circuits
title_full_unstemmed	Plasmonic interconnects for global wires in integrated circuits
title_sort	plasmonic interconnects for global wires in integrated circuits
publisher	InderScience
publishDate	2020
url	https://scholarbank.nus.edu.sg/handle/10635/183431
_version_	1821189681788747776

Plasmonic interconnects for global wires in integrated circuits

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