High-fidelity modelling of thermal stress for additive manufacturing by linking thermal-fluid and mechanical models
10.1016/j.matdes.2020.109185
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| Main Authors: | , |
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| Other Authors: | |
| Format: | Article |
| Published: |
Elsevier Ltd
2021
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| Subjects: | |
| Online Access: | https://scholarbank.nus.edu.sg/handle/10635/199432 |
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| Institution: | National University of Singapore |