Dynamic Mechanical and Failure Properties of Solder Joints

Ph.D

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Bibliographic Details
Main Author:	LIU JIANFEI
Other Authors:	MECHANICAL ENGINEERING
Format:	Theses and Dissertations
Language:	English
Published:	2011
Subjects:	IC package, solder joint, dynamic testing, mechanical properties, failure, finite element modeling
Online Access:	http://scholarbank.nus.edu.sg/handle/10635/20430
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Institution:	National University of Singapore
Language:	English

id	sg-nus-scholar.10635-20430
record_format	dspace
spelling	sg-nus-scholar.10635-204302017-10-21T08:19:30Z Dynamic Mechanical and Failure Properties of Solder Joints LIU JIANFEI MECHANICAL ENGINEERING SHIM PHYAU WUI, VICTOR TAN BENG CHYE, VINCENT IC package, solder joint, dynamic testing, mechanical properties, failure, finite element modeling Ph.D DOCTOR OF PHILOSOPHY 2011-02-28T18:01:00Z 2011-02-28T18:01:00Z 2010-07-08 Thesis LIU JIANFEI (2010-07-08). Dynamic Mechanical and Failure Properties of Solder Joints. ScholarBank@NUS Repository. http://scholarbank.nus.edu.sg/handle/10635/20430 NOT_IN_WOS en
institution	National University of Singapore
building	NUS Library
country	Singapore
collection	ScholarBank@NUS
language	English
topic	IC package, solder joint, dynamic testing, mechanical properties, failure, finite element modeling
spellingShingle	IC package, solder joint, dynamic testing, mechanical properties, failure, finite element modeling LIU JIANFEI Dynamic Mechanical and Failure Properties of Solder Joints
description	Ph.D
author2	MECHANICAL ENGINEERING
author_facet	MECHANICAL ENGINEERING LIU JIANFEI
format	Theses and Dissertations
author	LIU JIANFEI
author_sort	LIU JIANFEI
title	Dynamic Mechanical and Failure Properties of Solder Joints
title_short	Dynamic Mechanical and Failure Properties of Solder Joints
title_full	Dynamic Mechanical and Failure Properties of Solder Joints
title_fullStr	Dynamic Mechanical and Failure Properties of Solder Joints
title_full_unstemmed	Dynamic Mechanical and Failure Properties of Solder Joints
title_sort	dynamic mechanical and failure properties of solder joints
publishDate	2011
url	http://scholarbank.nus.edu.sg/handle/10635/20430
_version_	1681079756436537344

Dynamic Mechanical and Failure Properties of Solder Joints

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