Conformal hexagonal-boron nitride dielectric interface for tungsten diselenide devices with improved mobility and thermal dissipation

10.1038/s41467-019-09016-0

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Main Authors:	Liu, D., Chen, X., Yan, Y., Zhang, Z., Jin, Z., Yi, K., Zhang, C., Zheng, Y., Wang, Y., Yang, J., Xu, X., Chen, J., Lu, Y., Wei, D., Wee, A.T.S.
Other Authors:	CENTRE FOR ADVANCED 2D MATERIALS
Format:	Article
Published:	Nature Publishing Group 2022
Online Access:	https://scholarbank.nus.edu.sg/handle/10635/212772
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Institution:	National University of Singapore

id	sg-nus-scholar.10635-212772
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spelling	sg-nus-scholar.10635-2127722024-04-17T09:54:43Z Conformal hexagonal-boron nitride dielectric interface for tungsten diselenide devices with improved mobility and thermal dissipation Liu, D. Chen, X. Yan, Y. Zhang, Z. Jin, Z. Yi, K. Zhang, C. Zheng, Y. Wang, Y. Yang, J. Xu, X. Chen, J. Lu, Y. Wei, D. Wee, A.T.S. Wei, D. CENTRE FOR ADVANCED 2D MATERIALS PHYSICS 10.1038/s41467-019-09016-0 Nature Communications 10 1 1188 2022-01-03T03:48:50Z 2022-01-03T03:48:50Z 2019 Article Liu, D., Chen, X., Yan, Y., Zhang, Z., Jin, Z., Yi, K., Zhang, C., Zheng, Y., Wang, Y., Yang, J., Xu, X., Chen, J., Lu, Y., Wei, D., Wee, A.T.S., Wei, D. (2019). Conformal hexagonal-boron nitride dielectric interface for tungsten diselenide devices with improved mobility and thermal dissipation. Nature Communications 10 (1) : 1188. ScholarBank@NUS Repository. https://doi.org/10.1038/s41467-019-09016-0 20411723 https://scholarbank.nus.edu.sg/handle/10635/212772 Attribution 4.0 International https://creativecommons.org/licenses/by/4.0/ Nature Publishing Group Scopus OA2019
institution	National University of Singapore
building	NUS Library
continent	Asia
country	Singapore Singapore
content_provider	NUS Library
collection	ScholarBank@NUS
description	10.1038/s41467-019-09016-0
author2	CENTRE FOR ADVANCED 2D MATERIALS
author_facet	CENTRE FOR ADVANCED 2D MATERIALS Liu, D. Chen, X. Yan, Y. Zhang, Z. Jin, Z. Yi, K. Zhang, C. Zheng, Y. Wang, Y. Yang, J. Xu, X. Chen, J. Lu, Y. Wei, D. Wee, A.T.S. Wei, D.
format	Article
author	Liu, D. Chen, X. Yan, Y. Zhang, Z. Jin, Z. Yi, K. Zhang, C. Zheng, Y. Wang, Y. Yang, J. Xu, X. Chen, J. Lu, Y. Wei, D. Wee, A.T.S. Wei, D.
spellingShingle	Liu, D. Chen, X. Yan, Y. Zhang, Z. Jin, Z. Yi, K. Zhang, C. Zheng, Y. Wang, Y. Yang, J. Xu, X. Chen, J. Lu, Y. Wei, D. Wee, A.T.S. Wei, D. Conformal hexagonal-boron nitride dielectric interface for tungsten diselenide devices with improved mobility and thermal dissipation
author_sort	Liu, D.
title	Conformal hexagonal-boron nitride dielectric interface for tungsten diselenide devices with improved mobility and thermal dissipation
title_short	Conformal hexagonal-boron nitride dielectric interface for tungsten diselenide devices with improved mobility and thermal dissipation
title_full	Conformal hexagonal-boron nitride dielectric interface for tungsten diselenide devices with improved mobility and thermal dissipation
title_fullStr	Conformal hexagonal-boron nitride dielectric interface for tungsten diselenide devices with improved mobility and thermal dissipation
title_full_unstemmed	Conformal hexagonal-boron nitride dielectric interface for tungsten diselenide devices with improved mobility and thermal dissipation
title_sort	conformal hexagonal-boron nitride dielectric interface for tungsten diselenide devices with improved mobility and thermal dissipation
publisher	Nature Publishing Group
publishDate	2022
url	https://scholarbank.nus.edu.sg/handle/10635/212772
_version_	1800915291034615808

Conformal hexagonal-boron nitride dielectric interface for tungsten diselenide devices with improved mobility and thermal dissipation

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