Conformal hexagonal-boron nitride dielectric interface for tungsten diselenide devices with improved mobility and thermal dissipation

• Main Authors: Liu, D., Chen, X., Yan, Y., Zhang, Z., Jin, Z., Yi, K., Zhang, C., Zheng, Y., Wang, Y., Yang, J., Xu, X., Chen, J., Lu, Y., Wei, D., Wee, A.T.S.
• Other Authors: CENTRE FOR ADVANCED 2D MATERIALS
• Format: Article
• Published: Nature Publishing Group 2022
• Online Access: https://scholarbank.nus.edu.sg/handle/10635/212772
• Institution: National University of Singapore

10.1038/s41467-019-09016-0