Advances in flexible and soft electronics

10.1063/1.5095596

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Bibliographic Details
Main Authors: Djenizian, T., Tee, B.C.K., Ramuz, M., Fang, L.
Other Authors: MATERIALS SCIENCE AND ENGINEERING
Format: Editorial
Published: American Institute of Physics Inc. 2022
Online Access:https://scholarbank.nus.edu.sg/handle/10635/213702
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Institution: National University of Singapore
id sg-nus-scholar.10635-213702
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spelling sg-nus-scholar.10635-2137022024-04-17T02:40:46Z Advances in flexible and soft electronics Djenizian, T. Tee, B.C.K. Ramuz, M. Fang, L. MATERIALS SCIENCE AND ENGINEERING 10.1063/1.5095596 APL Materials 7 3 31201 2022-01-11T06:18:23Z 2022-01-11T06:18:23Z 2019 Editorial Djenizian, T., Tee, B.C.K., Ramuz, M., Fang, L. (2019). Advances in flexible and soft electronics. APL Materials 7 (3) : 31201. ScholarBank@NUS Repository. https://doi.org/10.1063/1.5095596 2166532X https://scholarbank.nus.edu.sg/handle/10635/213702 Attribution 4.0 International https://creativecommons.org/licenses/by/4.0/ American Institute of Physics Inc. Scopus OA2019
institution National University of Singapore
building NUS Library
continent Asia
country Singapore
Singapore
content_provider NUS Library
collection ScholarBank@NUS
description 10.1063/1.5095596
author2 MATERIALS SCIENCE AND ENGINEERING
author_facet MATERIALS SCIENCE AND ENGINEERING
Djenizian, T.
Tee, B.C.K.
Ramuz, M.
Fang, L.
format Editorial
author Djenizian, T.
Tee, B.C.K.
Ramuz, M.
Fang, L.
spellingShingle Djenizian, T.
Tee, B.C.K.
Ramuz, M.
Fang, L.
Advances in flexible and soft electronics
author_sort Djenizian, T.
title Advances in flexible and soft electronics
title_short Advances in flexible and soft electronics
title_full Advances in flexible and soft electronics
title_fullStr Advances in flexible and soft electronics
title_full_unstemmed Advances in flexible and soft electronics
title_sort advances in flexible and soft electronics
publisher American Institute of Physics Inc.
publishDate 2022
url https://scholarbank.nus.edu.sg/handle/10635/213702
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