Advances in flexible and soft electronics
10.1063/1.5095596
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American Institute of Physics Inc.
2022
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sg-nus-scholar.10635-2137022024-04-17T02:40:46Z Advances in flexible and soft electronics Djenizian, T. Tee, B.C.K. Ramuz, M. Fang, L. MATERIALS SCIENCE AND ENGINEERING 10.1063/1.5095596 APL Materials 7 3 31201 2022-01-11T06:18:23Z 2022-01-11T06:18:23Z 2019 Editorial Djenizian, T., Tee, B.C.K., Ramuz, M., Fang, L. (2019). Advances in flexible and soft electronics. APL Materials 7 (3) : 31201. ScholarBank@NUS Repository. https://doi.org/10.1063/1.5095596 2166532X https://scholarbank.nus.edu.sg/handle/10635/213702 Attribution 4.0 International https://creativecommons.org/licenses/by/4.0/ American Institute of Physics Inc. Scopus OA2019 |
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10.1063/1.5095596 |
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MATERIALS SCIENCE AND ENGINEERING |
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MATERIALS SCIENCE AND ENGINEERING Djenizian, T. Tee, B.C.K. Ramuz, M. Fang, L. |
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Editorial |
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Djenizian, T. Tee, B.C.K. Ramuz, M. Fang, L. |
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Djenizian, T. Tee, B.C.K. Ramuz, M. Fang, L. Advances in flexible and soft electronics |
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Djenizian, T. |
title |
Advances in flexible and soft electronics |
title_short |
Advances in flexible and soft electronics |
title_full |
Advances in flexible and soft electronics |
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Advances in flexible and soft electronics |
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Advances in flexible and soft electronics |
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advances in flexible and soft electronics |
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American Institute of Physics Inc. |
publishDate |
2022 |
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https://scholarbank.nus.edu.sg/handle/10635/213702 |
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