Heterogeneous wafer bonding technology and thin-film transfer technology-enabling platform for the next generation applications beyond 5g
10.3390/mi12080946
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2022
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sg-nus-scholar.10635-2337802024-04-16T11:54:29Z Heterogeneous wafer bonding technology and thin-film transfer technology-enabling platform for the next generation applications beyond 5g Ren, Zhihao Xu, Jikai Le, Xianhao Lee, Chengkuo COLLEGE OF DESIGN AND ENGINEERING ELECTRICAL AND COMPUTER ENGINEERING 5G 6G Artificial intelligence of thing (AIoT) Heterogeneous integration Internet of thing (IoT) Photonics Power electronics Sensor System-in-package (SiP) Thin-film transfer Wafer bonding Wearable electronics 10.3390/mi12080946 Micromachines 12 8 946 2022-10-26T09:15:45Z 2022-10-26T09:15:45Z 2021-08-11 Review Ren, Zhihao, Xu, Jikai, Le, Xianhao, Lee, Chengkuo (2021-08-11). Heterogeneous wafer bonding technology and thin-film transfer technology-enabling platform for the next generation applications beyond 5g. Micromachines 12 (8) : 946. ScholarBank@NUS Repository. https://doi.org/10.3390/mi12080946 2072-666X https://scholarbank.nus.edu.sg/handle/10635/233780 Attribution 4.0 International https://creativecommons.org/licenses/by/4.0/ MDPI AG Scopus OA2021 |
| institution |
National University of Singapore |
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NUS Library |
| continent |
Asia |
| country |
Singapore Singapore |
| content_provider |
NUS Library |
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ScholarBank@NUS |
| topic |
5G 6G Artificial intelligence of thing (AIoT) Heterogeneous integration Internet of thing (IoT) Photonics Power electronics Sensor System-in-package (SiP) Thin-film transfer Wafer bonding Wearable electronics |
| spellingShingle |
5G 6G Artificial intelligence of thing (AIoT) Heterogeneous integration Internet of thing (IoT) Photonics Power electronics Sensor System-in-package (SiP) Thin-film transfer Wafer bonding Wearable electronics Ren, Zhihao Xu, Jikai Le, Xianhao Lee, Chengkuo Heterogeneous wafer bonding technology and thin-film transfer technology-enabling platform for the next generation applications beyond 5g |
| description |
10.3390/mi12080946 |
| author2 |
COLLEGE OF DESIGN AND ENGINEERING |
| author_facet |
COLLEGE OF DESIGN AND ENGINEERING Ren, Zhihao Xu, Jikai Le, Xianhao Lee, Chengkuo |
| format |
Review |
| author |
Ren, Zhihao Xu, Jikai Le, Xianhao Lee, Chengkuo |
| author_sort |
Ren, Zhihao |
| title |
Heterogeneous wafer bonding technology and thin-film transfer technology-enabling platform for the next generation applications beyond 5g |
| title_short |
Heterogeneous wafer bonding technology and thin-film transfer technology-enabling platform for the next generation applications beyond 5g |
| title_full |
Heterogeneous wafer bonding technology and thin-film transfer technology-enabling platform for the next generation applications beyond 5g |
| title_fullStr |
Heterogeneous wafer bonding technology and thin-film transfer technology-enabling platform for the next generation applications beyond 5g |
| title_full_unstemmed |
Heterogeneous wafer bonding technology and thin-film transfer technology-enabling platform for the next generation applications beyond 5g |
| title_sort |
heterogeneous wafer bonding technology and thin-film transfer technology-enabling platform for the next generation applications beyond 5g |
| publisher |
MDPI AG |
| publishDate |
2022 |
| url |
https://scholarbank.nus.edu.sg/handle/10635/233780 |
| _version_ |
1800915692328845312 |