Heterogeneous wafer bonding technology and thin-film transfer technology-enabling platform for the next generation applications beyond 5g
10.3390/mi12080946
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| Main Authors: | , , , |
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| Other Authors: | |
| Format: | Review |
| Published: |
MDPI AG
2022
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| Subjects: | |
| Online Access: | https://scholarbank.nus.edu.sg/handle/10635/233780 |
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| Institution: | National University of Singapore |