Method to deposit a platinum seed layer for use in selective copper plating
US6251781
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2012
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| Online Access: | http://scholarbank.nus.edu.sg/handle/10635/32592 |
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sg-nus-scholar.10635-325922015-07-29T07:03:42Z Method to deposit a platinum seed layer for use in selective copper plating ZHOU, MEI SHENG XU, GUO-QIN CHAN, LAP CHEMISTRY CHARTERED SEMICONDUCTOR MANUFACTURING LTD. (SINGAPORE, SG) NATIONAL UNIVERSITY OF SINGAPORE US6251781 Granted Patent 2012-05-02T02:27:30Z 2012-05-02T02:27:30Z 2001-06-26 Patent ZHOU, MEI SHENG,XU, GUO-QIN,CHAN, LAP (2001-06-26). Method to deposit a platinum seed layer for use in selective copper plating. ScholarBank@NUS Repository. http://scholarbank.nus.edu.sg/handle/10635/32592 NOT_IN_WOS PatSnap |
| institution |
National University of Singapore |
| building |
NUS Library |
| country |
Singapore |
| collection |
ScholarBank@NUS |
| description |
US6251781 |
| author2 |
CHEMISTRY |
| author_facet |
CHEMISTRY ZHOU, MEI SHENG XU, GUO-QIN CHAN, LAP |
| format |
Patent |
| author |
ZHOU, MEI SHENG XU, GUO-QIN CHAN, LAP |
| spellingShingle |
ZHOU, MEI SHENG XU, GUO-QIN CHAN, LAP Method to deposit a platinum seed layer for use in selective copper plating |
| author_sort |
ZHOU, MEI SHENG |
| title |
Method to deposit a platinum seed layer for use in selective copper plating |
| title_short |
Method to deposit a platinum seed layer for use in selective copper plating |
| title_full |
Method to deposit a platinum seed layer for use in selective copper plating |
| title_fullStr |
Method to deposit a platinum seed layer for use in selective copper plating |
| title_full_unstemmed |
Method to deposit a platinum seed layer for use in selective copper plating |
| title_sort |
method to deposit a platinum seed layer for use in selective copper plating |
| publishDate |
2012 |
| url |
http://scholarbank.nus.edu.sg/handle/10635/32592 |
| _version_ |
1681081251561209856 |