WAFER LEVEL ELECTROLESS COPPER METALLIZATION AND BUMPING PROCESS, AND PLATING SOLUTIONS FOR SEMICONDUCTOR WAFER AND MICROCHIP

WAFER LEVEL ELECTROLESS COPPER METALLIZATION AND BUMPING PROCESS, AND PLATING SOLUTIONS FOR SEMICONDUCTOR WAFER AND MICROCHIP

WO2003098681A1

Saved in:
Bibliographic Details
Main Authors: LU, HAIJING, GONG, HAO, WONG, CHEE KHUEN STEPHEN
Other Authors: MATERIALS SCIENCE
Format: Patent
Published: 2012
Online Access:http://scholarbank.nus.edu.sg/handle/10635/35472
Tags: Add Tag
No Tags, Be the first to tag this record!
Institution: National University of Singapore
id sg-nus-scholar.10635-35472
record_format dspace
spelling sg-nus-scholar.10635-354722024-11-10T12:35:15Z WAFER LEVEL ELECTROLESS COPPER METALLIZATION AND BUMPING PROCESS, AND PLATING SOLUTIONS FOR SEMICONDUCTOR WAFER AND MICROCHIP LU, HAIJING GONG, HAO WONG, CHEE KHUEN STEPHEN MATERIALS SCIENCE NATIONAL UNIVERSITY OF SINGAPORE AGENCY FOR SCIENCE, TECHNOLOGY AND RESEARCH WO2003098681A1 Published Application 2012-11-21T08:58:19Z 2012-11-21T08:58:19Z 2003-11-27 Patent LU, HAIJING,GONG, HAO,WONG, CHEE KHUEN STEPHEN (2003-11-27). WAFER LEVEL ELECTROLESS COPPER METALLIZATION AND BUMPING PROCESS, AND PLATING SOLUTIONS FOR SEMICONDUCTOR WAFER AND MICROCHIP. ScholarBank@NUS Repository. http://scholarbank.nus.edu.sg/handle/10635/35472 NOT_IN_WOS PatSnap
institution National University of Singapore
building NUS Library
continent Asia
country Singapore
Singapore
content_provider NUS Library
collection ScholarBank@NUS
description WO2003098681A1
author2 MATERIALS SCIENCE
author_facet MATERIALS SCIENCE
LU, HAIJING
GONG, HAO
WONG, CHEE KHUEN STEPHEN
format Patent
author LU, HAIJING
GONG, HAO
WONG, CHEE KHUEN STEPHEN
spellingShingle LU, HAIJING
GONG, HAO
WONG, CHEE KHUEN STEPHEN
WAFER LEVEL ELECTROLESS COPPER METALLIZATION AND BUMPING PROCESS, AND PLATING SOLUTIONS FOR SEMICONDUCTOR WAFER AND MICROCHIP
author_sort LU, HAIJING
title WAFER LEVEL ELECTROLESS COPPER METALLIZATION AND BUMPING PROCESS, AND PLATING SOLUTIONS FOR SEMICONDUCTOR WAFER AND MICROCHIP
title_short WAFER LEVEL ELECTROLESS COPPER METALLIZATION AND BUMPING PROCESS, AND PLATING SOLUTIONS FOR SEMICONDUCTOR WAFER AND MICROCHIP
title_full WAFER LEVEL ELECTROLESS COPPER METALLIZATION AND BUMPING PROCESS, AND PLATING SOLUTIONS FOR SEMICONDUCTOR WAFER AND MICROCHIP
title_fullStr WAFER LEVEL ELECTROLESS COPPER METALLIZATION AND BUMPING PROCESS, AND PLATING SOLUTIONS FOR SEMICONDUCTOR WAFER AND MICROCHIP
title_full_unstemmed WAFER LEVEL ELECTROLESS COPPER METALLIZATION AND BUMPING PROCESS, AND PLATING SOLUTIONS FOR SEMICONDUCTOR WAFER AND MICROCHIP
title_sort wafer level electroless copper metallization and bumping process, and plating solutions for semiconductor wafer and microchip
publishDate 2012
url http://scholarbank.nus.edu.sg/handle/10635/35472
_version_ 1821214496758169600

Similar Items