Investigation into Solder Joint Failure in Portable Electronics Subjected to Drop Impact

Ph.D

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Bibliographic Details
Main Author:	SEAH KAH WOON, SIMON
Other Authors:	MECHANICAL ENGINEERING
Format:	Theses and Dissertations
Language:	English
Published:	2012
Subjects:	Solder Electronics Drop Shock Impact Fatigue
Online Access:	http://scholarbank.nus.edu.sg/handle/10635/35763
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Institution:	National University of Singapore
Language:	English

id	sg-nus-scholar.10635-35763
record_format	dspace
spelling	sg-nus-scholar.10635-357632015-01-14T09:33:37Z Investigation into Solder Joint Failure in Portable Electronics Subjected to Drop Impact SEAH KAH WOON, SIMON MECHANICAL ENGINEERING SHIM PHYAU WUI, VICTOR Solder Electronics Drop Shock Impact Fatigue Ph.D DOCTOR OF PHILOSOPHY 2012-12-14T18:00:07Z 2012-12-14T18:00:07Z 2012-08-17 Thesis SEAH KAH WOON, SIMON (2012-08-17). Investigation into Solder Joint Failure in Portable Electronics Subjected to Drop Impact. ScholarBank@NUS Repository. http://scholarbank.nus.edu.sg/handle/10635/35763 NOT_IN_WOS en
institution	National University of Singapore
building	NUS Library
country	Singapore
collection	ScholarBank@NUS
language	English
topic	Solder Electronics Drop Shock Impact Fatigue
spellingShingle	Solder Electronics Drop Shock Impact Fatigue SEAH KAH WOON, SIMON Investigation into Solder Joint Failure in Portable Electronics Subjected to Drop Impact
description	Ph.D
author2	MECHANICAL ENGINEERING
author_facet	MECHANICAL ENGINEERING SEAH KAH WOON, SIMON
format	Theses and Dissertations
author	SEAH KAH WOON, SIMON
author_sort	SEAH KAH WOON, SIMON
title	Investigation into Solder Joint Failure in Portable Electronics Subjected to Drop Impact
title_short	Investigation into Solder Joint Failure in Portable Electronics Subjected to Drop Impact
title_full	Investigation into Solder Joint Failure in Portable Electronics Subjected to Drop Impact
title_fullStr	Investigation into Solder Joint Failure in Portable Electronics Subjected to Drop Impact
title_full_unstemmed	Investigation into Solder Joint Failure in Portable Electronics Subjected to Drop Impact
title_sort	investigation into solder joint failure in portable electronics subjected to drop impact
publishDate	2012
url	http://scholarbank.nus.edu.sg/handle/10635/35763
_version_	1681081623037083648

Investigation into Solder Joint Failure in Portable Electronics Subjected to Drop Impact

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