Enhancing the performance of Sn-Ag-Cu solder with the addition of titanium diboride particulates
10.1115/IMECE2004-60456
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2014
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sg-nus-scholar.10635-515942015-01-25T22:43:56Z Enhancing the performance of Sn-Ag-Cu solder with the addition of titanium diboride particulates Nai, S.M.L. Wong, C.K. Wei, J. Gupta, M. MECHANICAL ENGINEERING 10.1115/IMECE2004-60456 American Society of Mechanical Engineers, Electronic and Photonic Packaging, EPP 4 315-318 EEAEE 2014-04-24T10:16:10Z 2014-04-24T10:16:10Z 2004 Conference Paper Nai, S.M.L.,Wong, C.K.,Wei, J.,Gupta, M. (2004). Enhancing the performance of Sn-Ag-Cu solder with the addition of titanium diboride particulates. American Society of Mechanical Engineers, Electronic and Photonic Packaging, EPP 4 : 315-318. ScholarBank@NUS Repository. <a href="https://doi.org/10.1115/IMECE2004-60456" target="_blank">https://doi.org/10.1115/IMECE2004-60456</a> http://scholarbank.nus.edu.sg/handle/10635/51594 NOT_IN_WOS Scopus |
| institution |
National University of Singapore |
| building |
NUS Library |
| country |
Singapore |
| collection |
ScholarBank@NUS |
| description |
10.1115/IMECE2004-60456 |
| author2 |
MECHANICAL ENGINEERING |
| author_facet |
MECHANICAL ENGINEERING Nai, S.M.L. Wong, C.K. Wei, J. Gupta, M. |
| format |
Conference or Workshop Item |
| author |
Nai, S.M.L. Wong, C.K. Wei, J. Gupta, M. |
| spellingShingle |
Nai, S.M.L. Wong, C.K. Wei, J. Gupta, M. Enhancing the performance of Sn-Ag-Cu solder with the addition of titanium diboride particulates |
| author_sort |
Nai, S.M.L. |
| title |
Enhancing the performance of Sn-Ag-Cu solder with the addition of titanium diboride particulates |
| title_short |
Enhancing the performance of Sn-Ag-Cu solder with the addition of titanium diboride particulates |
| title_full |
Enhancing the performance of Sn-Ag-Cu solder with the addition of titanium diboride particulates |
| title_fullStr |
Enhancing the performance of Sn-Ag-Cu solder with the addition of titanium diboride particulates |
| title_full_unstemmed |
Enhancing the performance of Sn-Ag-Cu solder with the addition of titanium diboride particulates |
| title_sort |
enhancing the performance of sn-ag-cu solder with the addition of titanium diboride particulates |
| publishDate |
2014 |
| url |
http://scholarbank.nus.edu.sg/handle/10635/51594 |
| _version_ |
1681083874796371968 |