Sequential observation of electroless copper deposition via noncontact atomic force microscopy
Journal of the Electrochemical Society
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sg-nus-scholar.10635-531602024-11-14T03:13:43Z Sequential observation of electroless copper deposition via noncontact atomic force microscopy Ng, H.T. Li, S.F.Y. Chan, L. Loh, F.C. Tan, K.L. PHYSICS CHEMISTRY Journal of the Electrochemical Society 145 9 3301-3307 JESOA 2014-05-19T02:55:00Z 2014-05-19T02:55:00Z 1998-09 Article Ng, H.T.,Li, S.F.Y.,Chan, L.,Loh, F.C.,Tan, K.L. (1998-09). Sequential observation of electroless copper deposition via noncontact atomic force microscopy. Journal of the Electrochemical Society 145 (9) : 3301-3307. ScholarBank@NUS Repository. 00134651 http://scholarbank.nus.edu.sg/handle/10635/53160 NOT_IN_WOS Scopus |
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PHYSICS Ng, H.T. Li, S.F.Y. Chan, L. Loh, F.C. Tan, K.L. |
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Ng, H.T. Li, S.F.Y. Chan, L. Loh, F.C. Tan, K.L. |
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Ng, H.T. Li, S.F.Y. Chan, L. Loh, F.C. Tan, K.L. Sequential observation of electroless copper deposition via noncontact atomic force microscopy |
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Ng, H.T. |
title |
Sequential observation of electroless copper deposition via noncontact atomic force microscopy |
title_short |
Sequential observation of electroless copper deposition via noncontact atomic force microscopy |
title_full |
Sequential observation of electroless copper deposition via noncontact atomic force microscopy |
title_fullStr |
Sequential observation of electroless copper deposition via noncontact atomic force microscopy |
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Sequential observation of electroless copper deposition via noncontact atomic force microscopy |
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sequential observation of electroless copper deposition via noncontact atomic force microscopy |
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2014 |
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http://scholarbank.nus.edu.sg/handle/10635/53160 |
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