Nondestructive defect characterization of saw-damage-etched multicrystalline silicon wafers using scanning electron acoustic microscopy

• Main Authors: Meng, L., Papa Rao, S.S., Bhatia, C.S., Steen, S.E., Street, A.G., Phang, J.C.H.
• 其他作者: ELECTRICAL & COMPUTER ENGINEERING
• 格式: Article
• 出版: 2014
• 主題: Multicrystalline silicon; nondestructive defect characterization; saw-damage etch; scanning electron acoustic microscopy (SEAM)
• 在線閱讀: http://scholarbank.nus.edu.sg/handle/10635/56809

10.1109/JPHOTOV.2012.2218579