Nondestructive defect characterization of saw-damage-etched multicrystalline silicon wafers using scanning electron acoustic microscopy

Nondestructive defect characterization of saw-damage-etched multicrystalline silicon wafers using scanning electron acoustic microscopy

10.1109/JPHOTOV.2012.2218579

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Bibliographic Details
Main Authors: Meng, L., Papa Rao, S.S., Bhatia, C.S., Steen, S.E., Street, A.G., Phang, J.C.H.
Other Authors: ELECTRICAL & COMPUTER ENGINEERING
Format: Article
Published: 2014
Subjects:
Multicrystalline silicon
nondestructive defect characterization
saw-damage etch
scanning electron acoustic microscopy (SEAM)
Online Access:http://scholarbank.nus.edu.sg/handle/10635/56809
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Institution: National University of Singapore

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http://scholarbank.nus.edu.sg/handle/10635/56809

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