Nondestructive defect characterization of saw-damage-etched multicrystalline silicon wafers using scanning electron acoustic microscopy

Nondestructive defect characterization of saw-damage-etched multicrystalline silicon wafers using scanning electron acoustic microscopy

10.1109/JPHOTOV.2012.2218579

Saved in:
Bibliographic Details
Main Authors: Meng, L., Papa Rao, S.S., Bhatia, C.S., Steen, S.E., Street, A.G., Phang, J.C.H.
Other Authors: ELECTRICAL & COMPUTER ENGINEERING
Format: Article
Published: 2014
Subjects:
Multicrystalline silicon
nondestructive defect characterization
saw-damage etch
scanning electron acoustic microscopy (SEAM)
Online Access:http://scholarbank.nus.edu.sg/handle/10635/56809
Tags: Add Tag
No Tags, Be the first to tag this record!
Institution: National University of Singapore
id sg-nus-scholar.10635-56809
record_format dspace
spelling sg-nus-scholar.10635-568092023-11-01T07:18:26Z Nondestructive defect characterization of saw-damage-etched multicrystalline silicon wafers using scanning electron acoustic microscopy Meng, L. Papa Rao, S.S. Bhatia, C.S. Steen, S.E. Street, A.G. Phang, J.C.H. ELECTRICAL & COMPUTER ENGINEERING Multicrystalline silicon nondestructive defect characterization saw-damage etch scanning electron acoustic microscopy (SEAM) 10.1109/JPHOTOV.2012.2218579 IEEE Journal of Photovoltaics 3 1 370-374 2014-06-17T02:58:51Z 2014-06-17T02:58:51Z 2013 Article Meng, L., Papa Rao, S.S., Bhatia, C.S., Steen, S.E., Street, A.G., Phang, J.C.H. (2013). Nondestructive defect characterization of saw-damage-etched multicrystalline silicon wafers using scanning electron acoustic microscopy. IEEE Journal of Photovoltaics 3 (1) : 370-374. ScholarBank@NUS Repository. https://doi.org/10.1109/JPHOTOV.2012.2218579 21563381 http://scholarbank.nus.edu.sg/handle/10635/56809 000318434000057 Scopus
institution National University of Singapore
building NUS Library
continent Asia
country Singapore
Singapore
content_provider NUS Library
collection ScholarBank@NUS
topic Multicrystalline silicon
nondestructive defect characterization
saw-damage etch
scanning electron acoustic microscopy (SEAM)
spellingShingle Multicrystalline silicon
nondestructive defect characterization
saw-damage etch
scanning electron acoustic microscopy (SEAM)
Meng, L.
Papa Rao, S.S.
Bhatia, C.S.
Steen, S.E.
Street, A.G.
Phang, J.C.H.
Nondestructive defect characterization of saw-damage-etched multicrystalline silicon wafers using scanning electron acoustic microscopy
description 10.1109/JPHOTOV.2012.2218579
author2 ELECTRICAL & COMPUTER ENGINEERING
author_facet ELECTRICAL & COMPUTER ENGINEERING
Meng, L.
Papa Rao, S.S.
Bhatia, C.S.
Steen, S.E.
Street, A.G.
Phang, J.C.H.
format Article
author Meng, L.
Papa Rao, S.S.
Bhatia, C.S.
Steen, S.E.
Street, A.G.
Phang, J.C.H.
author_sort Meng, L.
title Nondestructive defect characterization of saw-damage-etched multicrystalline silicon wafers using scanning electron acoustic microscopy
title_short Nondestructive defect characterization of saw-damage-etched multicrystalline silicon wafers using scanning electron acoustic microscopy
title_full Nondestructive defect characterization of saw-damage-etched multicrystalline silicon wafers using scanning electron acoustic microscopy
title_fullStr Nondestructive defect characterization of saw-damage-etched multicrystalline silicon wafers using scanning electron acoustic microscopy
title_full_unstemmed Nondestructive defect characterization of saw-damage-etched multicrystalline silicon wafers using scanning electron acoustic microscopy
title_sort nondestructive defect characterization of saw-damage-etched multicrystalline silicon wafers using scanning electron acoustic microscopy
publishDate 2014
url http://scholarbank.nus.edu.sg/handle/10635/56809
_version_ 1781781283881353216

Similar Items