A study of delamination growth in the die-attach layer of plastic IC packages under hygrothermal loading during solder reflow
10.1109/TDMR.2003.820793
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sg-nus-scholar.10635-592792024-11-13T13:22:37Z A study of delamination growth in the die-attach layer of plastic IC packages under hygrothermal loading during solder reflow Tay, A.A.O. Goh, K.Y. MECHANICAL ENGINEERING 10.1109/TDMR.2003.820793 IEEE Transactions on Device and Materials Reliability 3 4 144-151 2014-06-17T06:09:36Z 2014-06-17T06:09:36Z 2003-12 Article Tay, A.A.O., Goh, K.Y. (2003-12). A study of delamination growth in the die-attach layer of plastic IC packages under hygrothermal loading during solder reflow. IEEE Transactions on Device and Materials Reliability 3 (4) : 144-151. ScholarBank@NUS Repository. https://doi.org/10.1109/TDMR.2003.820793 15304388 http://scholarbank.nus.edu.sg/handle/10635/59279 000188377100005 Scopus |
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National University of Singapore |
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NUS Library |
| continent |
Asia |
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Singapore Singapore |
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NUS Library |
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ScholarBank@NUS |
| description |
10.1109/TDMR.2003.820793 |
| author2 |
MECHANICAL ENGINEERING |
| author_facet |
MECHANICAL ENGINEERING Tay, A.A.O. Goh, K.Y. |
| format |
Article |
| author |
Tay, A.A.O. Goh, K.Y. |
| spellingShingle |
Tay, A.A.O. Goh, K.Y. A study of delamination growth in the die-attach layer of plastic IC packages under hygrothermal loading during solder reflow |
| author_sort |
Tay, A.A.O. |
| title |
A study of delamination growth in the die-attach layer of plastic IC packages under hygrothermal loading during solder reflow |
| title_short |
A study of delamination growth in the die-attach layer of plastic IC packages under hygrothermal loading during solder reflow |
| title_full |
A study of delamination growth in the die-attach layer of plastic IC packages under hygrothermal loading during solder reflow |
| title_fullStr |
A study of delamination growth in the die-attach layer of plastic IC packages under hygrothermal loading during solder reflow |
| title_full_unstemmed |
A study of delamination growth in the die-attach layer of plastic IC packages under hygrothermal loading during solder reflow |
| title_sort |
study of delamination growth in the die-attach layer of plastic ic packages under hygrothermal loading during solder reflow |
| publishDate |
2014 |
| url |
http://scholarbank.nus.edu.sg/handle/10635/59279 |
| _version_ |
1821180864945455104 |