Development of high strength Sn-Mg solder alloys with reasonable ductility

Development of high strength Sn-Mg solder alloys with reasonable ductility

10.1007/s13391-013-2168-5

Saved in:
Bibliographic Details
Main Authors: Alam, M.E., Gupta, M.
Other Authors: MECHANICAL ENGINEERING
Format: Article
Published: 2014
Subjects:
lead-free solder
mechanical properties
melting temperature
microstructure
Sn-Mg solders
Online Access:http://scholarbank.nus.edu.sg/handle/10635/59935
Tags: Add Tag
No Tags, Be the first to tag this record!
Institution: National University of Singapore
Description
Summary:10.1007/s13391-013-2168-5

Similar Items