Development of high strength Sn-Mg solder alloys with reasonable ductility

10.1007/s13391-013-2168-5

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Bibliographic Details
Main Authors:	Alam, M.E., Gupta, M.
Other Authors:	MECHANICAL ENGINEERING
Format:	Article
Published:	2014
Subjects:	lead-free solder mechanical properties melting temperature microstructure Sn-Mg solders
Online Access:	http://scholarbank.nus.edu.sg/handle/10635/59935
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Institution:	National University of Singapore

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