Modeling vapor pressure effects on void rupture and crack growth resistance

10.1016/S1359-6454(02)00162-3

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Bibliographic Details
Main Authors: Guo, T.F., Cheng, L.
Other Authors: MECHANICAL ENGINEERING
Format: Article
Published: 2014
Subjects:
Online Access:http://scholarbank.nus.edu.sg/handle/10635/60804
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Institution: National University of Singapore