Modeling vapor pressure effects on void rupture and crack growth resistance
10.1016/S1359-6454(02)00162-3
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Main Authors: | Guo, T.F., Cheng, L. |
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Other Authors: | MECHANICAL ENGINEERING |
Format: | Article |
Published: |
2014
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Subjects: | |
Online Access: | http://scholarbank.nus.edu.sg/handle/10635/60804 |
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Institution: | National University of Singapore |
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