A new approach to determine wedge-indented interfacial toughness in soft-film hard-substrate systems with application to low-k films on Si substrate
10.1557/jmr.2012.319
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Main Authors: | , , , , |
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Other Authors: | |
Format: | Article |
Published: |
2014
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Subjects: | |
Online Access: | http://scholarbank.nus.edu.sg/handle/10635/84795 |
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Institution: | National University of Singapore |