A new approach to determine wedge-indented interfacial toughness in soft-film hard-substrate systems with application to low-k films on Si substrate

A new approach to determine wedge-indented interfacial toughness in soft-film hard-substrate systems with application to low-k films on Si substrate

10.1557/jmr.2012.319

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Bibliographic Details
Main Authors: Chen, L., Zeng, K., Zhang, Y., She, C., Liu, G.
Other Authors: MECHANICAL ENGINEERING
Format: Article
Published: 2014
Subjects:
correction factor
finite element analysis
interfacial toughness
soft-film hard-substrate (SFHS)
wedge indentation
Online Access:http://scholarbank.nus.edu.sg/handle/10635/84795
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Institution: National University of Singapore
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Summary:10.1557/jmr.2012.319

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