A new approach to determine wedge-indented interfacial toughness in soft-film hard-substrate systems with application to low-k films on Si substrate

10.1557/jmr.2012.319

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Bibliographic Details
Main Authors:	Chen, L., Zeng, K., Zhang, Y., She, C., Liu, G.
Other Authors:	MECHANICAL ENGINEERING
Format:	Article
Published:	2014
Subjects:	correction factor finite element analysis interfacial toughness soft-film hard-substrate (SFHS) wedge indentation
Online Access:	http://scholarbank.nus.edu.sg/handle/10635/84795
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Institution:	National University of Singapore

id	sg-nus-scholar.10635-84795
record_format	dspace
spelling	sg-nus-scholar.10635-847952023-10-31T07:44:22Z A new approach to determine wedge-indented interfacial toughness in soft-film hard-substrate systems with application to low-k films on Si substrate Chen, L. Zeng, K. Zhang, Y. She, C. Liu, G. MECHANICAL ENGINEERING correction factor finite element analysis interfacial toughness soft-film hard-substrate (SFHS) wedge indentation 10.1557/jmr.2012.319 Journal of Materials Research 27 22 2872-2883 JMREE 2014-10-07T09:00:24Z 2014-10-07T09:00:24Z 2012-11-28 Article Chen, L., Zeng, K., Zhang, Y., She, C., Liu, G. (2012-11-28). A new approach to determine wedge-indented interfacial toughness in soft-film hard-substrate systems with application to low-k films on Si substrate. Journal of Materials Research 27 (22) : 2872-2883. ScholarBank@NUS Repository. https://doi.org/10.1557/jmr.2012.319 08842914 http://scholarbank.nus.edu.sg/handle/10635/84795 000311302800008 Scopus
institution	National University of Singapore
building	NUS Library
continent	Asia
country	Singapore Singapore
content_provider	NUS Library
collection	ScholarBank@NUS
topic	correction factor finite element analysis interfacial toughness soft-film hard-substrate (SFHS) wedge indentation
spellingShingle	correction factor finite element analysis interfacial toughness soft-film hard-substrate (SFHS) wedge indentation Chen, L. Zeng, K. Zhang, Y. She, C. Liu, G. A new approach to determine wedge-indented interfacial toughness in soft-film hard-substrate systems with application to low-k films on Si substrate
description	10.1557/jmr.2012.319
author2	MECHANICAL ENGINEERING
author_facet	MECHANICAL ENGINEERING Chen, L. Zeng, K. Zhang, Y. She, C. Liu, G.
format	Article
author	Chen, L. Zeng, K. Zhang, Y. She, C. Liu, G.
author_sort	Chen, L.
title	A new approach to determine wedge-indented interfacial toughness in soft-film hard-substrate systems with application to low-k films on Si substrate
title_short	A new approach to determine wedge-indented interfacial toughness in soft-film hard-substrate systems with application to low-k films on Si substrate
title_full	A new approach to determine wedge-indented interfacial toughness in soft-film hard-substrate systems with application to low-k films on Si substrate
title_fullStr	A new approach to determine wedge-indented interfacial toughness in soft-film hard-substrate systems with application to low-k films on Si substrate
title_full_unstemmed	A new approach to determine wedge-indented interfacial toughness in soft-film hard-substrate systems with application to low-k films on Si substrate
title_sort	new approach to determine wedge-indented interfacial toughness in soft-film hard-substrate systems with application to low-k films on si substrate
publishDate	2014
url	http://scholarbank.nus.edu.sg/handle/10635/84795
_version_	1781784508765306880

A new approach to determine wedge-indented interfacial toughness in soft-film hard-substrate systems with application to low-k films on Si substrate

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