Influence of vapor pressure on rate-dependent void growth in IC packages

10.1109/EPTC.2007.4469724

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Bibliographic Details
Main Authors: Wong, W.H., Guo, T.F., Cheng, L.
Other Authors: MATERIALS SCIENCE AND ENGINEERING
Format: Conference or Workshop Item
Published: 2014
Online Access:http://scholarbank.nus.edu.sg/handle/10635/86912
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Institution: National University of Singapore