Influence of vapor pressure on rate-dependent void growth in IC packages
10.1109/EPTC.2007.4469724
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Main Authors: | Wong, W.H., Guo, T.F., Cheng, L. |
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Other Authors: | MATERIALS SCIENCE AND ENGINEERING |
Format: | Conference or Workshop Item |
Published: |
2014
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Online Access: | http://scholarbank.nus.edu.sg/handle/10635/86912 |
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Institution: | National University of Singapore |
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