Thermomechanical analysis of plastic ball grid arrays with vapor pressure effects

Thermomechanical analysis of plastic ball grid arrays with vapor pressure effects

IEEE Transactions on Components and Packaging Technologies

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Bibliographic Details
Main Authors: Cheong, W.G., Chew, H.B., Guo, T.F., Cheng, L.
Other Authors: MATERIALS SCIENCE AND ENGINEERING
Format: Article
Published: 2014
Subjects:
Finite-element analysis
Interfacial adhesion
Micromechanical damage
Moisture sensitivity
Package reliability
Online Access:http://scholarbank.nus.edu.sg/handle/10635/61564
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Institution: National University of Singapore

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http://scholarbank.nus.edu.sg/handle/10635/61564

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