New methodology for mechanical characterisation of solders for IC packaging

New methodology for mechanical characterisation of solders for IC packaging

Advances in Electronic Packaging

Saved in:
Bibliographic Details
Main Authors: Lok, T.S., Siong, C.F., Kuan, L.B., Hua, W.E.
Other Authors: MECHANICAL ENGINEERING
Published: 2014
Online Access:http://scholarbank.nus.edu.sg/handle/10635/73679
Tags: Add Tag
No Tags, Be the first to tag this record!
Institution: National University of Singapore

Internet

http://scholarbank.nus.edu.sg/handle/10635/73679

Similar Items