New methodology for mechanical characterisation of solders for IC packaging

Advances in Electronic Packaging

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Bibliographic Details
Main Authors:	Lok, T.S., Siong, C.F., Kuan, L.B., Hua, W.E.
Other Authors:	MECHANICAL ENGINEERING
Published:	2014
Online Access:	http://scholarbank.nus.edu.sg/handle/10635/73679
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Institution:	National University of Singapore

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