New methodology for mechanical characterisation of solders for IC packaging

Advances in Electronic Packaging

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Bibliographic Details
Main Authors:	Lok, T.S., Siong, C.F., Kuan, L.B., Hua, W.E.
Other Authors:	MECHANICAL ENGINEERING
Published:	2014
Online Access:	http://scholarbank.nus.edu.sg/handle/10635/73679
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Institution:	National University of Singapore

id	sg-nus-scholar.10635-73679
record_format	dspace
spelling	sg-nus-scholar.10635-736792021-10-25T15:17:17Z New methodology for mechanical characterisation of solders for IC packaging Lok, T.S. Siong, C.F. Kuan, L.B. Hua, W.E. MECHANICAL ENGINEERING Advances in Electronic Packaging 1 551-558 2014-06-19T05:38:03Z 2014-06-19T05:38:03Z 2003 Lok, T.S., Siong, C.F., Kuan, L.B., Hua, W.E. (2003). New methodology for mechanical characterisation of solders for IC packaging. Advances in Electronic Packaging 1 : 551-558. ScholarBank@NUS Repository. 0791836908 http://scholarbank.nus.edu.sg/handle/10635/73679 NOT_IN_WOS Scopus
institution	National University of Singapore
building	NUS Library
continent	Asia
country	Singapore Singapore
content_provider	NUS Library
collection	ScholarBank@NUS
description	Advances in Electronic Packaging
author2	MECHANICAL ENGINEERING
author_facet	MECHANICAL ENGINEERING Lok, T.S. Siong, C.F. Kuan, L.B. Hua, W.E.
author	Lok, T.S. Siong, C.F. Kuan, L.B. Hua, W.E.
spellingShingle	Lok, T.S. Siong, C.F. Kuan, L.B. Hua, W.E. New methodology for mechanical characterisation of solders for IC packaging
author_sort	Lok, T.S.
title	New methodology for mechanical characterisation of solders for IC packaging
title_short	New methodology for mechanical characterisation of solders for IC packaging
title_full	New methodology for mechanical characterisation of solders for IC packaging
title_fullStr	New methodology for mechanical characterisation of solders for IC packaging
title_full_unstemmed	New methodology for mechanical characterisation of solders for IC packaging
title_sort	new methodology for mechanical characterisation of solders for ic packaging
publishDate	2014
url	http://scholarbank.nus.edu.sg/handle/10635/73679
_version_	1715195349580120064

New methodology for mechanical characterisation of solders for IC packaging

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