New methodology for mechanical characterisation of solders for IC packaging

New methodology for mechanical characterisation of solders for IC packaging

Advances in Electronic Packaging

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Bibliographic Details
Main Authors: Lok, T.S., Siong, C.F., Kuan, L.B., Hua, W.E.
Other Authors: MECHANICAL ENGINEERING
Published: 2014
Online Access:http://scholarbank.nus.edu.sg/handle/10635/73679
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Institution: National University of Singapore
Description
Summary:Advances in Electronic Packaging

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