Using carbon nanotubes to enhance creep performance of lead free solder

10.1179/174328408X282155

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Bibliographic Details
Main Authors: Nai, S.M.L., Wei, J., Gupta, M.
Other Authors: MECHANICAL ENGINEERING
Format: Article
Published: 2014
Subjects:
Online Access:http://scholarbank.nus.edu.sg/handle/10635/61651
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Institution: National University of Singapore
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