Geometric modelling of IC die bonds for inspection
Pattern Recognition Letters
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sg-nus-scholar.10635-622572015-01-08T02:12:55Z Geometric modelling of IC die bonds for inspection Ngan, K.N. Kang, S.B. ELECTRICAL ENGINEERING IC bond inspection machine vision pattern recognition Pattern Recognition Letters 10 1 47-52 2014-06-17T06:49:04Z 2014-06-17T06:49:04Z 1989-07 Article Ngan, K.N.,Kang, S.B. (1989-07). Geometric modelling of IC die bonds for inspection. Pattern Recognition Letters 10 (1) : 47-52. ScholarBank@NUS Repository. 01678655 http://scholarbank.nus.edu.sg/handle/10635/62257 NOT_IN_WOS Scopus |
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National University of Singapore |
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NUS Library |
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Singapore |
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ScholarBank@NUS |
| topic |
IC bond inspection machine vision pattern recognition |
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IC bond inspection machine vision pattern recognition Ngan, K.N. Kang, S.B. Geometric modelling of IC die bonds for inspection |
| description |
Pattern Recognition Letters |
| author2 |
ELECTRICAL ENGINEERING |
| author_facet |
ELECTRICAL ENGINEERING Ngan, K.N. Kang, S.B. |
| format |
Article |
| author |
Ngan, K.N. Kang, S.B. |
| author_sort |
Ngan, K.N. |
| title |
Geometric modelling of IC die bonds for inspection |
| title_short |
Geometric modelling of IC die bonds for inspection |
| title_full |
Geometric modelling of IC die bonds for inspection |
| title_fullStr |
Geometric modelling of IC die bonds for inspection |
| title_full_unstemmed |
Geometric modelling of IC die bonds for inspection |
| title_sort |
geometric modelling of ic die bonds for inspection |
| publishDate |
2014 |
| url |
http://scholarbank.nus.edu.sg/handle/10635/62257 |
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1681085742832418816 |