Geometric modelling of IC die bonds for inspection
Pattern Recognition Letters
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Main Authors: | Ngan, K.N., Kang, S.B. |
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Other Authors: | ELECTRICAL ENGINEERING |
Format: | Article |
Published: |
2014
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Subjects: | |
Online Access: | http://scholarbank.nus.edu.sg/handle/10635/62257 |
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Institution: | National University of Singapore |
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