Deep-learning based IC die identification and die surface defect inspection

Much effort is needed when detecting faults in semiconductors during the manufacturing process. With the rise of artificial intelligence to enhance processes, many would wonder how it is incorporated with semiconductor technologies. However, as a substantial amount of training data is required for t...

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Bibliographic Details
Main Author: Teo, Kai Yu
Other Authors: Qian Kemao
Format: Final Year Project
Language:English
Published: Nanyang Technological University 2023
Subjects:
Online Access:https://hdl.handle.net/10356/166704
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Institution: Nanyang Technological University
Language: English