Deep-learning based IC die identification and die surface defect inspection

• Main Author: Teo, Kai Yu
• Other Authors: Qian Kemao
• Format: Final Year Project
• Language: English
• Published: Nanyang Technological University 2023
• Subjects: Engineering::Computer science and engineering
• Online Access: https://hdl.handle.net/10356/166704
• Institution: Nanyang Technological University

Much effort is needed when detecting faults in semiconductors during the manufacturing process. With the rise of artificial intelligence to enhance processes, many would wonder how it is incorporated with semiconductor technologies. However, as a substantial amount of training data is required for t...