Automatic IC Die Positioning in the SEM

Conference Proceedings from the International Symposium for Testing and Failure Analysis

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Bibliographic Details
Main Authors: Tan, H.W., Phang, J.C.H., Thong, J.T.L.
Other Authors: ELECTRICAL ENGINEERING
Format: Conference or Workshop Item
Published: 2014
Online Access:http://scholarbank.nus.edu.sg/handle/10635/72500
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Institution: National University of Singapore