Surface modification of SiLK® by graft copolymerization with 4-vinylpyridine for reduction in copper diffusion

• Main Authors: Zhu, Y.Q., Kang, E.T., Neoh, K.G., Chan, L., Lai, D.M.Y., Huan, A.C.H.
• Other Authors: CHEMICAL & BIOMOLECULAR ENGINEERING
• Format: Article
• Published: 2014
• Subjects: 4-Vinylpyridine; Adhesion; Copper diffusion; Graft copolymerization; SiLK®; ToF-SIMS; XPS
• Online Access: http://scholarbank.nus.edu.sg/handle/10635/64648
• Institution: National University of Singapore

10.1016/j.apsusc.2003.09.046