Electroless plating of copper on fluorinated polyimide films modified by plasma graft copolymerization and UV-induced graft copolymerization with 4-vinylpyridine

Electroless plating of copper on fluorinated polyimide films modified by plasma graft copolymerization and UV-induced graft copolymerization with 4-vinylpyridine

10.1002/mame.200390008

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Bibliographic Details
Main Authors: Wang, W.C., Vora, R.K.H., Kang, E.T., Neoh, K.G.
Other Authors: CHEMICAL & ENVIRONMENTAL ENGINEERING
Format: Article
Published: 2014
Subjects:
4-Vinylpyridine
Adhesion
Copper
Electroless plating
Fluorinated polyimides
Graft copolymerization
Online Access:http://scholarbank.nus.edu.sg/handle/10635/91962
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Institution: National University of Singapore

Internet

http://scholarbank.nus.edu.sg/handle/10635/91962

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