Electroless plating of copper on polyimide films modified by surface grafting of tertiary and quaternary amines polymers

10.1016/S0032-3861(02)00263-X

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Bibliographic Details
Main Authors: Yu, Z.J., Kang, E.T., Neoh, K.G.
Other Authors: CHEMICAL & ENVIRONMENTAL ENGINEERING
Format: Article
Published: 2014
Subjects:
Online Access:http://scholarbank.nus.edu.sg/handle/10635/91966
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Institution: National University of Singapore