Electroless plating of copper on polyimide films modified by surface grafting of tertiary and quaternary amines polymers

Electroless plating of copper on polyimide films modified by surface grafting of tertiary and quaternary amines polymers

10.1016/S0032-3861(02)00263-X

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Bibliographic Details
Main Authors: Yu, Z.J., Kang, E.T., Neoh, K.G.
Other Authors: CHEMICAL & ENVIRONMENTAL ENGINEERING
Format: Article
Published: 2014
Subjects:
Electroless plating
Graft copolymerization
Polyimides
Online Access:http://scholarbank.nus.edu.sg/handle/10635/91966
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Institution: National University of Singapore
Description
Summary:10.1016/S0032-3861(02)00263-X

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