Electroless plating of copper on fluorinated polyimide films modified by plasma graft copolymerization and UV-induced graft copolymerization with 4-vinylpyridine

10.1002/mame.200390008

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Main Authors: Wang, W.C., Vora, R.K.H., Kang, E.T., Neoh, K.G.
Other Authors: CHEMICAL & ENVIRONMENTAL ENGINEERING
Format: Article
Published: 2014
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Online Access:http://scholarbank.nus.edu.sg/handle/10635/91962
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spelling sg-nus-scholar.10635-919622024-11-11T07:28:10Z Electroless plating of copper on fluorinated polyimide films modified by plasma graft copolymerization and UV-induced graft copolymerization with 4-vinylpyridine Wang, W.C. Vora, R.K.H. Kang, E.T. Neoh, K.G. CHEMICAL & ENVIRONMENTAL ENGINEERING MATERIALS SCIENCE 4-Vinylpyridine Adhesion Copper Electroless plating Fluorinated polyimides Graft copolymerization 10.1002/mame.200390008 Macromolecular Materials and Engineering 288 2 152-163 MMENF 2014-10-09T09:53:13Z 2014-10-09T09:53:13Z 2003-02-20 Article Wang, W.C., Vora, R.K.H., Kang, E.T., Neoh, K.G. (2003-02-20). Electroless plating of copper on fluorinated polyimide films modified by plasma graft copolymerization and UV-induced graft copolymerization with 4-vinylpyridine. Macromolecular Materials and Engineering 288 (2) : 152-163. ScholarBank@NUS Repository. https://doi.org/10.1002/mame.200390008 14387492 http://scholarbank.nus.edu.sg/handle/10635/91962 000182047600007 Scopus
institution National University of Singapore
building NUS Library
continent Asia
country Singapore
Singapore
content_provider NUS Library
collection ScholarBank@NUS
topic 4-Vinylpyridine
Adhesion
Copper
Electroless plating
Fluorinated polyimides
Graft copolymerization
spellingShingle 4-Vinylpyridine
Adhesion
Copper
Electroless plating
Fluorinated polyimides
Graft copolymerization
Wang, W.C.
Vora, R.K.H.
Kang, E.T.
Neoh, K.G.
Electroless plating of copper on fluorinated polyimide films modified by plasma graft copolymerization and UV-induced graft copolymerization with 4-vinylpyridine
description 10.1002/mame.200390008
author2 CHEMICAL & ENVIRONMENTAL ENGINEERING
author_facet CHEMICAL & ENVIRONMENTAL ENGINEERING
Wang, W.C.
Vora, R.K.H.
Kang, E.T.
Neoh, K.G.
format Article
author Wang, W.C.
Vora, R.K.H.
Kang, E.T.
Neoh, K.G.
author_sort Wang, W.C.
title Electroless plating of copper on fluorinated polyimide films modified by plasma graft copolymerization and UV-induced graft copolymerization with 4-vinylpyridine
title_short Electroless plating of copper on fluorinated polyimide films modified by plasma graft copolymerization and UV-induced graft copolymerization with 4-vinylpyridine
title_full Electroless plating of copper on fluorinated polyimide films modified by plasma graft copolymerization and UV-induced graft copolymerization with 4-vinylpyridine
title_fullStr Electroless plating of copper on fluorinated polyimide films modified by plasma graft copolymerization and UV-induced graft copolymerization with 4-vinylpyridine
title_full_unstemmed Electroless plating of copper on fluorinated polyimide films modified by plasma graft copolymerization and UV-induced graft copolymerization with 4-vinylpyridine
title_sort electroless plating of copper on fluorinated polyimide films modified by plasma graft copolymerization and uv-induced graft copolymerization with 4-vinylpyridine
publishDate 2014
url http://scholarbank.nus.edu.sg/handle/10635/91962
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