Surface graft copolymerization enhanced adhesion of an epoxy-based printed circuit board substrate (FR-4) to copper
10.1109/6040.763194
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2014
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sg-nus-scholar.10635-668242023-09-05T21:01:25Z Surface graft copolymerization enhanced adhesion of an epoxy-based printed circuit board substrate (FR-4) to copper Liu, Y.X. Kang, E.T. Neoh, K.G. Zhang, J.F. Cui, C.Q. Lim, T.B. CHEMICAL & ENVIRONMENTAL ENGINEERING INSTITUTE OF MICROELECTRONICS 10.1109/6040.763194 IEEE Transactions on Advanced Packaging 22 2 214-220 ITAPF 2014-06-17T08:34:52Z 2014-06-17T08:34:52Z 1999 Article Liu, Y.X., Kang, E.T., Neoh, K.G., Zhang, J.F., Cui, C.Q., Lim, T.B. (1999). Surface graft copolymerization enhanced adhesion of an epoxy-based printed circuit board substrate (FR-4) to copper. IEEE Transactions on Advanced Packaging 22 (2) : 214-220. ScholarBank@NUS Repository. https://doi.org/10.1109/6040.763194 15213323 http://scholarbank.nus.edu.sg/handle/10635/66824 000080640000016 Scopus |
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National University of Singapore |
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NUS Library |
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Asia |
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Singapore Singapore |
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NUS Library |
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| description |
10.1109/6040.763194 |
| author2 |
CHEMICAL & ENVIRONMENTAL ENGINEERING |
| author_facet |
CHEMICAL & ENVIRONMENTAL ENGINEERING Liu, Y.X. Kang, E.T. Neoh, K.G. Zhang, J.F. Cui, C.Q. Lim, T.B. |
| format |
Article |
| author |
Liu, Y.X. Kang, E.T. Neoh, K.G. Zhang, J.F. Cui, C.Q. Lim, T.B. |
| spellingShingle |
Liu, Y.X. Kang, E.T. Neoh, K.G. Zhang, J.F. Cui, C.Q. Lim, T.B. Surface graft copolymerization enhanced adhesion of an epoxy-based printed circuit board substrate (FR-4) to copper |
| author_sort |
Liu, Y.X. |
| title |
Surface graft copolymerization enhanced adhesion of an epoxy-based printed circuit board substrate (FR-4) to copper |
| title_short |
Surface graft copolymerization enhanced adhesion of an epoxy-based printed circuit board substrate (FR-4) to copper |
| title_full |
Surface graft copolymerization enhanced adhesion of an epoxy-based printed circuit board substrate (FR-4) to copper |
| title_fullStr |
Surface graft copolymerization enhanced adhesion of an epoxy-based printed circuit board substrate (FR-4) to copper |
| title_full_unstemmed |
Surface graft copolymerization enhanced adhesion of an epoxy-based printed circuit board substrate (FR-4) to copper |
| title_sort |
surface graft copolymerization enhanced adhesion of an epoxy-based printed circuit board substrate (fr-4) to copper |
| publishDate |
2014 |
| url |
http://scholarbank.nus.edu.sg/handle/10635/66824 |
| _version_ |
1776257017920356352 |