Three dimensional finite element analysis of the evolution of voids and thin films by strain and electromigration induced surface diffusion

Three dimensional finite element analysis of the evolution of voids and thin films by strain and electromigration induced surface diffusion

Journal of the Mechanics and Physics of Solids

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Bibliographic Details
Main Authors: Zhang, Y.W., Bower, A.F., Xia, L., Shih, C.F.
Other Authors: DEAN'S OFFICE (ENGINEERING)
Format: Article
Published: 2014
Subjects:
A. Diffusion
A. Electromigration
A. Surface
B. Elastic material
C. Finite elements
Online Access:http://scholarbank.nus.edu.sg/handle/10635/67813
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Institution: National University of Singapore

Internet

http://scholarbank.nus.edu.sg/handle/10635/67813

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