Three dimensional finite element analysis of the evolution of voids and thin films by strain and electromigration induced surface diffusion

Journal of the Mechanics and Physics of Solids

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Bibliographic Details
Main Authors: Zhang, Y.W., Bower, A.F., Xia, L., Shih, C.F.
Other Authors: DEAN'S OFFICE (ENGINEERING)
Format: Article
Published: 2014
Subjects:
Online Access:http://scholarbank.nus.edu.sg/handle/10635/67813
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Institution: National University of Singapore
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